SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device includes a wiring substrate, a lower magnetic shield member, a semiconductor chip, and an upper magnetic shield member. The lower magnetic shield member is provided on the wiring substrate. The semiconductor chip is provided on the lower magnetic shield member. The semiconduct...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ARAI TADASHI, TAKEUCHI YUKIHARU
Format: Patent
Sprache:eng
Schlagworte:
ELECTRICITY
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Beschreibung
Zusammenfassung:A semiconductor device includes a wiring substrate, a lower magnetic shield member, a semiconductor chip, and an upper magnetic shield member. The lower magnetic shield member is provided on the wiring substrate. The semiconductor chip is provided on the lower magnetic shield member. The semiconductor chip includes a magnetic memory element. The upper magnetic shield member is provided on the semiconductor chip. The semiconductor chip is disposed between the upper magnetic shield member and the lower magnetic shield member. The lower magnetic shield member and the upper magnetic shield member include a soft magnetic resin. The lower magnetic shield member and the upper magnetic shield member are in direct contact with each other.