ALUMINUM ALLOY MATERIAL HAVING THERMAL BONDING FUNCTION IN SINGLE LAYER, MANUFACTURING METHOD FOR SAME, AND ALUMINUM BONDED BODY USING THE ALUMINUM ALLOY MATERIAL

This invention provides an aluminum alloy material capable of being thermally bonded in a single layer without using a bonding agent, such as a brazing or welding filler metal. This invention also provides a bonding method for the aluminum alloy material, and an aluminum bonded body using the alumin...

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Bibliographische Detailangaben
Hauptverfasser: MATSUI YU, MURASE TAKASHI, ARAKI TOSHIO, MOCHIDUKI JUNICHI, NIIKURA AKIO, KUROSAKI TOMOHITO, TERAYAMA KAZUKO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:This invention provides an aluminum alloy material capable of being thermally bonded in a single layer without using a bonding agent, such as a brazing or welding filler metal. This invention also provides a bonding method for the aluminum alloy material, and an aluminum bonded body using the aluminum alloy material. The aluminum alloy material is made of an aluminum alloy containing Si: 1.0 to 5.0 mass % and Fe: 0.01 to 2.0 mass % with the balance Al and inevitable impurities. The aluminum alloy material contains 10 to 1×104 pieces/μm3 of Al-based intermetallic compounds having equivalent circle diameters of 0.01 to 0.5 μm and 200 pieces/mm2 or less of Si-based intermetallic compounds having equivalent circle diameters of 5.0 to 10 μm.