METHOD FOR MANUFACTURING IMAGE PICKUP MODULE
The present invention achieves reduction in size and thickness while removing the cause of defective image and the like. According to an image pickup module (1), a solid-state image pickup device (3) and a flexible substrate (2) are connected to each other by flip-chip bonding, and an opening (5) is...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention achieves reduction in size and thickness while removing the cause of defective image and the like. According to an image pickup module (1), a solid-state image pickup device (3) and a flexible substrate (2) are connected to each other by flip-chip bonding, and an opening (5) is formed in the flexible substrate 2 by melting the flexible substrate (2) and an anisotropically-conductive film (8) adhered to the flexible substrate (2). |
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