SEMICONDUCTOR DEVICE

According to one embodiment, there is provided a semiconductor device including an interposer, a logic chip, a memory chip, and a package substrate. In the interposer, first via is configured to electrically connect a signal terminal of the logic chip and a signal terminal of the memory chip to each other through a substrate. Multi-layer wiring is disposed on first principal surface side of the substrate. Power supply terminal of the logic chip is electrically connected to the multi-layer wiring. Power supply pad is disposed on the first principal surface side of the substrate and configured to be electrically connected to the power supply terminal of the logic chip through the multi-layer wiring. A metal wire is connected to power supply pad. The package substrate includes a power supply wiring. The power supply pad and the power supply wiring are electrically connected to each other through the metal wire.