Semiconductor Device
A semiconductor device according to the present invention includes: an insulating substrate; a circuit pattern having a first surface that is bonded to a first main surface of the insulating substrate and a second surface opposite to the first surface on which a semiconductor element is bonded; a ba...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A semiconductor device according to the present invention includes: an insulating substrate; a circuit pattern having a first surface that is bonded to a first main surface of the insulating substrate and a second surface opposite to the first surface on which a semiconductor element is bonded; a back surface pattern having a first surface that is bonded to a second main surface of the insulating substrate; and a heat dissipation plate bonded to a second surface of the back surface pattern opposite to the first surface of the back surface pattern. A curvature of a corner portion of the circuit pattern is greater than a curvature of a corner portion of the back surface pattern, and the corner portion of the circuit pattern is located inside the corner portion of the back surface pattern in a plan view. |
|---|