METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCTURES FORMED THEREBY

METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCTURES FORMED THEREBY

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine fo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOFGREEN KELLY P, NARDI PATRICK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.