MICROPILLAR-ENABLED THERMAL GROUND PLANE

MICROPILLAR-ENABLED THERMAL GROUND PLANE

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more plan...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEWIS RYAN JOHN, COOLIDGE COLLIN JENNINGS, YANG RONGGUI, LEE YUNGNG, LIEW LI-ANNE, XU SHANSHAN, LIN CHING-YI
Format: Patent
Sprache:eng
Schlagworte:
BLASTING
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MECHANICAL ENGINEERING
WEAPONS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.