UNDER-FILL MATERIAL, SEALING SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Provided are an under-fill material which is capable of reducing a difference in thermal response behavior between a semiconductor element and an adherend and which makes it easy and convenient to perform alignment for mounting the semiconductor element, a sealing sheet including the under-fill mate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKAMOTO NAOHIDE, MORITA KOSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are an under-fill material which is capable of reducing a difference in thermal response behavior between a semiconductor element and an adherend and which makes it easy and convenient to perform alignment for mounting the semiconductor element, a sealing sheet including the under-fill material, and a method for producing a semiconductor device using the under-fill material. In the under-fill material of the present invention, a haze is 70% or less before a heat curing treatment, and a storage elastic modulus E′ [MPa] and a thermal expansion coefficient α [ppm/K] after the under-fill material is subjected to a heat curing treatment at 175° C. for 1 hour satisfy the following formula (1) at 25° C.: 10000