Metallized electric component

Various embodiments provide a metallized electric component for an electronic module, wherein the metallized electric component comprises a conductive electric element; and a metallization structure arranged over the conductive electric element and comprising at least a surface metallization layer,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAHLER JOACHIM, LEE CHEN WEN, KOLMEDER GUENTHER
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Various embodiments provide a metallized electric component for an electronic module, wherein the metallized electric component comprises a conductive electric element; and a metallization structure arranged over the conductive electric element and comprising at least a surface metallization layer, wherein the surface metallization layer comprises gold and silver and has a thickness between 2 nm and 100 nm.