COMPONENT FOR SEMICONDUCTOR PROCESS CHAMBER HAVING SURFACE TREATMENT TO REDUCE PARTICLE EMISSION

Examples of the disclosure generally relate to a component for use in a semiconductor process chamber includes a body having machined surfaces including a first surface and a second surface. The first surface is configured to interface with a support member of the semiconductor process chamber. The...

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Bibliographische Detailangaben
Hauptverfasser:	KHAN ANISUL H, SUN JENNIFER, CHOI JINHAN, SRINIVASAN SUNIL, KANUNGO BIRAJA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES HEATING KILNS LIGHTING MECHANICAL ENGINEERING OVENS PERFORMING OPERATIONS RETORTS SEMICONDUCTOR DEVICES SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURESCONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER TRANSPORTING WEAPONS WORKING CEMENT, CLAY, OR STONE
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Beschreibung
Zusammenfassung:	Examples of the disclosure generally relate to a component for use in a semiconductor process chamber includes a body having machined surfaces including a first surface and a second surface. The first surface is configured to interface with a support member of the semiconductor process chamber. The second surface is configured to face a processing region of the semiconductor process chamber. A treated area of the second surface includes relatively flatter peaks than an untreated area of the machined surfaces and exhibits an average roughness between 1 and 30 micro-inches.