PEELING PROCESS OF SUBSTRATE

PEELING PROCESS OF SUBSTRATE

A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bondi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LUAN TA-NIEN, CHIANG MING-SHENG, WU CHI-MING, LU WENANG
Format: Patent
Sprache:eng
Schlagworte:
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. Thereafter, the second substrate is peeled off from the first substrate.