MANUFACTURING METHOD OF SUBSTRATE, CUTTING METHOD OF PROCESSING OBJECT AND LASER PROCESSING APPARATUS

A manufacturing method of a substrate, the method includes a crack forming process of forming a crack along an interface between a first portion of a processing object and a second portion of the processing object, the crack-forming process forming the crack in a manner that an ultrashort-pulse lase...

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Bibliographische Detailangaben
1. Verfasser:	TANIGAWA TATSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A manufacturing method of a substrate, the method includes a crack forming process of forming a crack along an interface between a first portion of a processing object and a second portion of the processing object, the crack-forming process forming the crack in a manner that an ultrashort-pulse laser light is irradiated so that a focus point thereof is positioned at the interface or in a vicinity thereof, and a separating process of separating the processing object at the crack, wherein an impurity concentration of the first portion and an impurity concentration of the second portion are different from each other or material of the first portion and material of the second portion are different from each other.