PACKAGE STRUCTURE OF LIGHT-EMITTING DIODE MODULE AND METHOD FOR MANUFACTURING THE SAME

The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.