A LIQUID COOLED DEVICE ENCLOSURE

The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method.

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Bibliographische Detailangaben
Hauptverfasser: AYYILMAZ TOLGA, KAYNAKOZ MUHARREM, ALAKOC UGUR
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method.