A LIQUID COOLED DEVICE ENCLOSURE
The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method. |
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