THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR

THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR

A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate.

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Hauptverfasser: SMITH GABRIEL MICHAEL, CAI DENGKE, MAYER MARK J, JACOB CHERIAN, SAHA KOUSHIK, WARD BENJAMIN JAMES, LOU XIAOMEI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SMITH GABRIEL MICHAEL
CAI DENGKE
MAYER MARK J
JACOB CHERIAN
SAHA KOUSHIK
WARD BENJAMIN JAMES
LOU XIAOMEI
description A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR
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