THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR

A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate.

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Bibliographische Detailangaben
Hauptverfasser:	SMITH GABRIEL MICHAEL, CAI DENGKE, MAYER MARK J, JACOB CHERIAN, SAHA KOUSHIK, WARD BENJAMIN JAMES, LOU XIAOMEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate.