SYSTEM AND METHOD FOR CUTTING LAMINATED STRUCTURES
The present invention is directed to a system and method for processing a laminated structure having a plurality of laminate layers. The system includes a laser assembly that provides a plurality of laser burst emissions having predetermined laser characteristics and an optical assembly that focuses...
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Zusammenfassung: | The present invention is directed to a system and method for processing a laminated structure having a plurality of laminate layers. The system includes a laser assembly that provides a plurality of laser burst emissions having predetermined laser characteristics and an optical assembly that focuses each laser burst emission to a predetermined focal line. The method selects laser characteristics and focal line parameters for each laser burst emission such that a defect having predetermined dimensions is formed at a predetermined location within the laminated structure. The laminated structure moves in relation to the optical assembly such that the plurality of laser burst emissions form a plurality of said defects corresponding to a multi-dimensional defect pattern within the laminated structure, each said defect being substantially generated by induced absorption. |
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