Method for Producing an Optoelectronic Device and Optoelectronic Device

A method for producing an optoelectronic device is specified. A housing base body is formed with a self-healing polymer material. A recess is found in the housing base body. The recess is confined by a bottom surface and at least one side wall which are formed at least in places by the plastic material of the base body. An optoelectronic semiconductor chip has a first main surface, a second main surface facing away from the first main surface and at least one side surface connecting the first main surface and the second main surface with each other. The optoelectronic semiconductor chip is placed in the recess, so that the first main surface is brought in contact with the bottom surface and the at least one side surface is brought in contact with the at least one side wall.