Sequencing of Multi-Pass Laser Shock Peening Applications

A method for laser shock peening (LSP) a workpiece is disclosed. The method may include identifying a geometry of the workpiece, determining a number of applications of LSP upon a first side and a second side of the workpiece, and sequencing the applications among the first side and the second side...

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1. Verfasser: FILEWICH PAUL
Format: Patent
Sprache:eng
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Zusammenfassung:A method for laser shock peening (LSP) a workpiece is disclosed. The method may include identifying a geometry of the workpiece, determining a number of applications of LSP upon a first side and a second side of the workpiece, and sequencing the applications among the first side and the second side to minimize distortion.