LIQUID COMPOSITION USED IN ETCHING MULTILAYER FILM CONTAINING COPPER AND MOLYBDENUM, MANUFACTURING METHOD OF SUBSTRATE USING SAID LIQUID COMPOSITION, AND SUBSTRATE MANUFACTURED BY SAID MANUFACTURING METHOD

The present invention provides a liquid composition used for etching a multilayer film containing copper and molybdenum, an etching method for etching a multilayer film containing copper and molybdenum, and a substrate. The present invention further provides a liquid composition for etching a multilayer-film wiring substrate which has an oxide layer (IGZO) including indium, gallium and zinc laminated on the substrate, and further a multilayer film including at least a layer containing molybdenum and a layer containing copper provided thereon, a method for etching a multilayer film containing copper and molybdenum from the substrate, and a substrate. According to the present invention, a liquid composition comprising (A) a maleic acid ion source, (B) a copper ion source, and (C) at least one type of amine compound selected from the group consisting of 1-amino-2-propanol, 2-(methylamino)ethanol, 2-(ethylamino)ethanol, 2-(butylamino)ethanol, 2-(dimethylamino)ethanol, 2-(diethylamino)ethanol, 2-methoxyethylamine, 3-methoxypropylamine, 3-amino-1-propanol, 2-amino-2-methyl-1-propanol, 1-dimethylamino-2-propanol, 2-(2-aminoethoxyl)ethanol, morpholine and 4-(2-hydroxyethyl)morpholine and having a pH value of 4-9 is used.