METHODS OF REMOVING A HARD MASK

METHODS OF REMOVING A HARD MASK

In a method of removing a hard mask, a hard mask is formed on a substrate. A first plasma treatment is performed on the hard mask at a first temperature. A second plasma treatment is performed on the hard mask at a second temperature higher than the first temperature.

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Bibliographische Detailangaben
Hauptverfasser: MIN GYUNG-JIN, HAN JE-WOO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In a method of removing a hard mask, a hard mask is formed on a substrate. A first plasma treatment is performed on the hard mask at a first temperature. A second plasma treatment is performed on the hard mask at a second temperature higher than the first temperature.