Apparatus And Process Containment For Spatially Separated Atomic Layer Deposition

Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising a plurality of elongate gas ports with gas curtains extending along the outer length of the gas distribution plate. Also provided are atomic layer deposition apparatuses and methods including a g...

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Bibliographische Detailangaben
1. Verfasser:	KWONG GARRY K
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising a plurality of elongate gas ports with gas curtains extending along the outer length of the gas distribution plate. Also provided are atomic layer deposition apparatuses and methods including a gas distribution plate with a plurality of elongate gas ports with gas curtains.