CURABLE RESIN COMPOSITION, RESIN MOLD FOR IMPRINTING, METHOD FOR PHOTO IMPRINTING, METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT, AND METHOD FOR MANUFACTURING FINE OPTICAL ELEMENT

CURABLE RESIN COMPOSITION, RESIN MOLD FOR IMPRINTING, METHOD FOR PHOTO IMPRINTING, METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT, AND METHOD FOR MANUFACTURING FINE OPTICAL ELEMENT

A curable resin composition comprising: a fluorinated urethane(meth)acrylate represented by formula (1), wherein, R1, R2, R3 and R4 each independently represents a hydrogen atom or a methyl group, x and y each independently represents 1 or 2, and n represents an integer within the range of 1 to 10;...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OSAKI TAKESHI, WADA RISA
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:A curable resin composition comprising: a fluorinated urethane(meth)acrylate represented by formula (1), wherein, R1, R2, R3 and R4 each independently represents a hydrogen atom or a methyl group, x and y each independently represents 1 or 2, and n represents an integer within the range of 1 to 10; R3 and R4 each independently represents the hydrogen atom when x and y are both 1; R3 represents the hydrogen atom and R4 represents the methyl group when x is 1 and y is 2; R3 represents the methyl group and R4 represents the hydrogen atom when x is 2 and y is 1; and R3 and R4 each independently represents the methyl group when x and y are both 2.