Thermally Tempered Glass Substrate Using CTE Mismatched Layers And Paste Mixtures For Transient Electronic Systems

A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.