SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

A semiconductor device includes a die pad having an upper surface and a lower surface opposite to the upper surface, a semiconductor chip having a main surface and a back surface opposite to the main surface so that a plurality of electrode pads are formed on the main surface and being mounted on the die pad so that the back surface is opposite to the upper surface of the die pad, a plurality of leads arranged to be aligned on a side of the die pad, a first wire electrically connecting between a first electrode pad among the plurality of electrode pads of the semiconductor chip and a first lead among the plurality of leads, and a second wire having a diameter thicker than a diameter of the first wire and electrically connecting between a second electrode pad among the plurality of electrode pads of the semiconductor chip.