RESIN COMPOSITION FOR INSULATING MATERIALS, INSULATING INK, INSULATING FILM AND ORGANIC FIELD EFFECT TRANSISTOR USING INSULATING FILM

The present invention provides an insulating material which has a high curing rate as well as solvent resistance suitable for a printing method while having a high degree of breakdown strength as well as a low leak current density in order to improve the performance of an organic field effect transi...

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Bibliographische Detailangaben
Hauptverfasser:	OKAMOTO TOMOKO, MINAKUCHI RYO, SAKURAI YOSHINOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides an insulating material which has a high curing rate as well as solvent resistance suitable for a printing method while having a high degree of breakdown strength as well as a low leak current density in order to improve the performance of an organic field effect transistor, and also provides an insulating film having the insulating material and a transistor. A resin composition for insulating materials contains a vinyl polymer, and the vinyl polymer has an acid value of 20 mgKOH/g or less, a (meth)acryloyl group equivalent of 220 to 1600 g/eq, and phenyl groups and (meth)acryloyl groups.