COMPOSITE SUBSTRATE FOR LAYERED HEATERS

A heater assembly for use in semiconductor processing that includes an application substrate; a heater substrate secured to the application substrate by a thermal bonding process; and a functional layer disposed onto the heater substrate by a layered process. In this heater assembly, the heater subs...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LINDLEY JACOB R, MEYER DEAN J, GLEW ALEXANDER D
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A heater assembly for use in semiconductor processing that includes an application substrate; a heater substrate secured to the application substrate by a thermal bonding process; and a functional layer disposed onto the heater substrate by a layered process. In this heater assembly, the heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer.