APPARATUS AND METHOD FOR PLACING STRESSORS WITHIN AN INTEGRATED CIRCUIT DEVICE TO MANAGE ELECTROMIGRATION FAILURES

A method for selecting locations within an integrated circuit device for placing stressors to manage electromigration failures includes calculating an electric current for an interconnect within the integrated circuit device and determining an electromigration stress profile for the interconnect bas...

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Bibliographische Detailangaben
Hauptverfasser:	SHROFF MEHUL D, REBER DOUGLAS M, TRAVIS EDWARD O
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method for selecting locations within an integrated circuit device for placing stressors to manage electromigration failures includes calculating an electric current for an interconnect within the integrated circuit device and determining an electromigration stress profile for the interconnect based on the electric current. The method further includes determining an area on the interconnect for placing a stressor to alter the electromigration stress profile for the interconnect.