Platen With Multiple Shaped Grounding Structures

A platen having different grounding structures is disclosed. Different grounding structures, such as pins, flat-end posts and mushroom-shaped grounding structures, may be disposed on the surface of a platen. Each type of grounding structure may be advantageously used with a particular type of workpi...

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Bibliographische Detailangaben
1. Verfasser:	LEE WILLIAM DAVIS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A platen having different grounding structures is disclosed. Different grounding structures, such as pins, flat-end posts and mushroom-shaped grounding structures, may be disposed on the surface of a platen. Each type of grounding structure may be advantageously used with a particular type of workpiece. In one embodiment, all of the different grounding structures are mechanically biased upward, such as by springs, from the surface of the platen such that all may contact the back surface of a workpiece disposed on the platen. In another embodiment, one or more actuators are used to lift and lower subsets of the grounding structures such that only a subset of the grounding structures contacts the back surface of the workpiece. These subsets may be all a single type of grounding structure, or may be associated with a particular type of workpiece.