CONDUCTIVE MICROPARTICLES

CONDUCTIVE MICROPARTICLES

Conductive microparticles, each are composed of a polymer microparticle and a conductive layer formed by coating the surface of the polymer microparticle with a metal. The conductive microparticles have an elastic modulus (E) at 5% displacement of 1-100 MPa. Especially when the conductive microparti...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ASANO ITARU, TAKEZAKI HIROSHI, OHNO AYANO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
CONDUCTORS
ELECTRICITY
INSULATORS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Conductive microparticles, each are composed of a polymer microparticle and a conductive layer formed by coating the surface of the polymer microparticle with a metal. The conductive microparticles have an elastic modulus (E) at 5% displacement of 1-100 MPa. Especially when the conductive microparticles have a shape recovery ratio (SR) of 0.1-13% under a load of 9.8 mN, a particle size distribution index of 1-3 and a particle size of 0.1-100 μm, the conductive microparticles can exhibit excellent conduction reliability in applications such as conductive adhesives for flexible boards.