Chip Level Heat Dissipation Using Silicon

Chip Level Heat Dissipation Using Silicon

A semiconductor device that includes a semiconductor chip having a first silicon substrate with opposing first and second surfaces, a semiconductor device formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the semiconduc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: OGANESIAN VAGE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device that includes a semiconductor chip having a first silicon substrate with opposing first and second surfaces, a semiconductor device formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the semiconductor device, a layer of thermal conductive material on the second surface, and a plurality of first vias formed partially through the layer of thermal conductive material.