SEMICONDUCTOR DEVICE
The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor ele...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor element (20) bonded on the base body via an adhesive member (30), wherein the adhesive member (30) contains surface-treated particles (40), or particles (40) that coexist with a dispersing agent, and at least a part of the marginal portion (301) of the adhesive member is a region where the particles (40) are unevenly distributed. |
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