PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTROCHEMICAL DEVICE

Provided is a pressure-sensitive adhesive tape for electrochemical devices according to the present invention. The adhesive tape is for use in electrochemical device production and includes a substrate and a pressure-sensitive adhesive layer. The adhesive layer is disposed on or over at least one si...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KAWABE SHIGEKI, HANAI HIROOMI, TAKAMURA YUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a pressure-sensitive adhesive tape for electrochemical devices according to the present invention. The adhesive tape is for use in electrochemical device production and includes a substrate and a pressure-sensitive adhesive layer. The adhesive layer is disposed on or over at least one side of the substrate and contains an acrylic polymer as a base polymer. The adhesive tape has a first and a second 180° peel adhesion strength. The first 180° peel adhesion strength is measured at 25° C. and a peeling speed of 300 mm/min after bonded to a SUS 304BA plate at a temperature of from 40° C. to below 150° C. The second 180° peel adhesion strength is measured at 25° C. and a peeling speed of 300 mm/min after bonded to a SUS 304BA plate at 25° C. The first 180° peel adhesion strength is twice or more as high as the second 180° peel adhesion strength.