Circuit Carrier With Interior Plating Lines and Peripheral Shielding

A dielectric substrate may serve as a circuit carrier for integrated circuits and other electrical components. The dielectric substrate may be formed from a dielectric material such as a ceramic substrate material, a printed circuit board substrate material, or other substrate material. The dielectric substrate may have a rectangular outline with four peripheral edge surfaces. The dielectric material may contain multiple layers that are laminated together and may support metal traces forming contacts and other interconnects. Integrated circuits and other electrical components may be mounted to the contacts. The metal traces may include electroplating lines that extend inwardly. The dielectric material may have a rectangular ring shape with a central rectangular opening having inner edge surfaces. The electroplating lines may be exposed along the inner edge surfaces. The four peripheral edge surfaces may be provided with a conductive electromagnetic interference shielding layer.