Circuit Card Apparatus And Methods

A circuit card apparatus includes a circuit card and a heat dissipation device in thermal contact with the circuit card at a thermal interface to conduct heat from the circuit card. An adjustable spacing element is adjustably coupled to one of the heat dissipation device and the circuit card. The ad...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	POWER-FARDY RICK, SCHMIDT BOB, STRAZNICKY IVAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A circuit card apparatus includes a circuit card and a heat dissipation device in thermal contact with the circuit card at a thermal interface to conduct heat from the circuit card. An adjustable spacing element is adjustably coupled to one of the heat dissipation device and the circuit card. The adjustable spacing element is configured to be adjusted to set a minimum spaced distance between a portion of the circuit card and a portion of the heat dissipation device. A locking element is coupled to the adjustable spacing element to lock the minimum spaced distance. In further examples, methods of manufacturing a circuit card apparatus include the step of adjusting a spacing element to set the spaced distance as a minimum spaced distance between a portion of a heat dissipation device and a portion of a circuit card. The method further comprises the step of locking the minimum spaced distance.