SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device is provided with a base member having a front surface and a plurality of semiconductor chips provided on the front surface and each having a long side and a short side, the plurality of semiconductor chips being aligned so that the long sides are faced with each other. The plu...

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1. Verfasser: MIYAWAKI KATSUMI
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor device is provided with a base member having a front surface and a plurality of semiconductor chips provided on the front surface and each having a long side and a short side, the plurality of semiconductor chips being aligned so that the long sides are faced with each other. The plurality of semiconductor chips are provided diagonally, respectively, so that the adjacent semiconductor chips are inclined to the same side in a planer view of the front surface.