SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOSOYAMADA SUMIKAZU, NAKAMURA SHINGO, CHIKAI TOMOSHIGE, MIYAKOSHI TAKESHI, MATSUBARA HIROAKI, SAKUMOTO SHOTARO, KUMAGAYA YOSHIKAZU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.