SPUTTERING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

A sputtering apparatus includes a shutter unit, a plurality of target holders, and a substrate holder which can rotate about an axis perpendicular to a surface on which a substrate is held. The shutter unit includes a first shutter having first and second apertures and a second shutter having third...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA EIJI, NAKAZAWA TOSHIKAZU, SUDA SHINTARO, FUJIMOTO YUU, YASUMATSU YASUSHI, TOYA HIROYUKI, IMAI SHIN, ISHIHARA SHIGENORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY
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