SPUTTERING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

SPUTTERING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

A sputtering apparatus includes a shutter unit, a plurality of target holders, and a substrate holder which can rotate about an axis perpendicular to a surface on which a substrate is held. The shutter unit includes a first shutter having first and second apertures and a second shutter having third...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAMURA EIJI, NAKAZAWA TOSHIKAZU, SUDA SHINTARO, FUJIMOTO YUU, YASUMATSU YASUSHI, TOYA HIROYUKI, IMAI SHIN, ISHIHARA SHIGENORI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Beschreibung
Zusammenfassung:A sputtering apparatus includes a shutter unit, a plurality of target holders, and a substrate holder which can rotate about an axis perpendicular to a surface on which a substrate is held. The shutter unit includes a first shutter having first and second apertures and a second shutter having third and fourth apertures. The plurality of target holders are arranged on a first virtual circle centered on the axis, with the arrangement intervals between the plurality of target holders on the first virtual circle including at least two types of arrangement intervals.