PACKAGED LASER DIODE AND METHOD OF PACKAGING A LASER DIODE

PACKAGED LASER DIODE AND METHOD OF PACKAGING A LASER DIODE

A leadframe-type packaged laser diode is provided, in which the laser diode chip is electrically decoupled from the package. A leadframe-type package including a two-dimensional grid of electrodes encapsulated in a molded plastic framework allows batch processing of one- or two-dimensional arrays of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE KONG WENG, WONG VINCENT V
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Beschreibung
Zusammenfassung:A leadframe-type packaged laser diode is provided, in which the laser diode chip is electrically decoupled from the package. A leadframe-type package including a two-dimensional grid of electrodes encapsulated in a molded plastic framework allows batch processing of one- or two-dimensional arrays of leadframes, the batch processing including laser diode chips attachment, wirebonding, and packaging, with subsequent breakout of individual packaged laser diodes from the one- or two-dimensional array.