BONDING PAD STRUCTURE AND TOUCH PANEL

A bonding pad structure including a first sub-bonding pad and a second sub-bonding pad and a touch panel are provided. The first sub-bonding pad has a first connection terminal at an opposite side of a first end terminal. A width of the first connection terminal is greater than a width of the first...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIANG RAY, TENG FEI, LIU ZHENG-XIANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CALCULATING COMPUTING CONDUCTORS COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY INSULATORS PHYSICS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A bonding pad structure including a first sub-bonding pad and a second sub-bonding pad and a touch panel are provided. The first sub-bonding pad has a first connection terminal at an opposite side of a first end terminal. A width of the first connection terminal is greater than a width of the first end terminal. The first sub-bonding pad has a second connection terminal at an opposite side of a second end terminal. A width of the second connection terminal is greater than a width of the second end terminal. The first connection terminal is close to the second end terminal and the second connection terminal is close to the first end terminal. A first outline of the first sub-bonding pad and a second outline of the second sub-bonding pad are formed as a pair in a complementary manner to construct a configuration of the bonding pad structure.