MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT
A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the trans...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MOHD ARSHAD MOHAMED ASHRAF LIM JIN KEONG |
| description | A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2015250063A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2015250063A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2015250063A13</originalsourceid><addsrcrecordid>eNrjZHD09fdxcXVRCPAPdw1SCA4NCPCJVAiODA5x9VXwcAzz9HNXcFQI8XAN8nX0Acp4-gWH-jiGADU4-_sG-Pu5-oXwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0NTI1MDAzNjR0Nj4lQBAKzZLCw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT</title><source>esp@cenet</source><creator>MOHD ARSHAD MOHAMED ASHRAF ; LIM JIN KEONG</creator><creatorcontrib>MOHD ARSHAD MOHAMED ASHRAF ; LIM JIN KEONG</creatorcontrib><description>A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150903&DB=EPODOC&CC=US&NR=2015250063A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150903&DB=EPODOC&CC=US&NR=2015250063A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOHD ARSHAD MOHAMED ASHRAF</creatorcontrib><creatorcontrib>LIM JIN KEONG</creatorcontrib><title>MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT</title><description>A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD09fdxcXVRCPAPdw1SCA4NCPCJVAiODA5x9VXwcAzz9HNXcFQI8XAN8nX0Acp4-gWH-jiGADU4-_sG-Pu5-oXwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0NTI1MDAzNjR0Nj4lQBAKzZLCw</recordid><startdate>20150903</startdate><enddate>20150903</enddate><creator>MOHD ARSHAD MOHAMED ASHRAF</creator><creator>LIM JIN KEONG</creator><scope>EVB</scope></search><sort><creationdate>20150903</creationdate><title>MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT</title><author>MOHD ARSHAD MOHAMED ASHRAF ; LIM JIN KEONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2015250063A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MOHD ARSHAD MOHAMED ASHRAF</creatorcontrib><creatorcontrib>LIM JIN KEONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOHD ARSHAD MOHAMED ASHRAF</au><au>LIM JIN KEONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT</title><date>2015-09-03</date><risdate>2015</risdate><abstract>A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2015250063A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T16%3A24%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MOHD%20ARSHAD%20MOHAMED%20ASHRAF&rft.date=2015-09-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2015250063A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |