MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT

A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the trans...

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Bibliographische Detailangaben
Hauptverfasser:	MOHD ARSHAD MOHAMED ASHRAF, LIM JIN KEONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.