SUBSTRATE ALIGNMENT MARK AND FABRICATING METHOD THEREOF, AND SUBSTRATE

A substrate alignment mark and a fabricating method thereof, and a substrate are provided. The substrate alignment mark includes a first alignment mark pattern and a second alignment mark pattern that are formed in a different-layer structure on a substrate, the first alignment mark pattern and the second alignment mark pattern are provided with centers thereof aligned and without overlapping portions. Therefore, because two alignment marks are formed in a different-layer structure on a substrate, when uneven film formation occurs in the process of forming one of the alignment marks, causing the alignment mark to be unidentifiable in alignment, the alignment can still be performed by identifying the other alignment mark, thus identification success rate of alignment marks is increased, and then defective rate caused by failure to identify alignment marks in manufacturing process of the substrate is noticeably decreased.