Surface Treated Copper Foil and Laminate Using the Same

A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of −0.35 to 0.53, c...

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Bibliographische Detailangaben
Hauptverfasser: ARAI HIDETA, ARAI KOHSUKE, NAKAMURO KAICHIRO, MIKI ATSUSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of −0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve: Sv=( B×0.1)/(t1−t2)  (1); wherein the brightness curve is obtained from an observation spot versus brightness graph, and the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an edge of the mark to a portion without the mark is represented by B ( B=Bt−Bb); and wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1 B in the range from the intersections of the brightness curve and Bt to a depth of 0.1 B with Bt as reference.