UNIVERSAL PROCESS CARRIER FOR SUBSTRATES

A carrier apparatus and method of assembling a carrier apparatus for processing a substrate. The carrier including a first carrier plate having a first plurality of cavities, each of the first plurality of cavities dimensioned to receive a first side of a substrate. The carrier further including a s...

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Bibliographische Detailangaben
Hauptverfasser:	TOC HOWELL JOHN CHUA, YANG ANNABELLE Q, WEBSTER STEVEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A carrier apparatus and method of assembling a carrier apparatus for processing a substrate. The carrier including a first carrier plate having a first plurality of cavities, each of the first plurality of cavities dimensioned to receive a first side of a substrate. The carrier further including a second carrier plate having a second plurality of cavities, each of the second plurality of cavities dimensioned to receive a second side of the substrate when the first carrier plate and the second carrier plate are placed in contact with one another. A magnet assembly is further provided which is configured to hold the first carrier plate and the second carrier plate together, the magnet assembly having at least one magnet positioned within a recess formed along one side of the first carrier plate or the second carrier plate.