PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

Embodiments of the present disclosure provide a method that includes providing a semiconductor substrate comprising a semiconductor material, forming a dielectric layer on the semiconductor substrate, forming an interconnect layer on the dielectric layer, attaching a semiconductor die to the semicon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIOU SHIANN-MING, WEI CHIENUAN, WU ALBERT, SUTARDJA SEHAT, CHENG CHUANNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of the present disclosure provide a method that includes providing a semiconductor substrate comprising a semiconductor material, forming a dielectric layer on the semiconductor substrate, forming an interconnect layer on the dielectric layer, attaching a semiconductor die to the semiconductor substrate, and electrically coupling an active side of the semiconductor die to the interconnect layer, the interconnect layer to route electrical signals of the semiconductor die. Other embodiments may be described and/or claimed.