METHOD FOR MANUFACTURING FLEXIBLE-EMBEDDED ELECTRODE FILM USING HEAT-PRESSURE WELDING TRANSCRIPTION

This invention relates to a method of manufacturing a buried flexible electrode film, including 1) preparing a release-substrate; 2) forming a conductive pattern layer on the release-substrate; 3) positioning a transfer-substrate on the conductive pattern layer and then performing thermal and pressu...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG JINMI, KIM JAEJIN, LEE JONGBYUNG, SHIN BUGON, PARK JEONGHO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	This invention relates to a method of manufacturing a buried flexible electrode film, including 1) preparing a release-substrate; 2) forming a conductive pattern layer on the release-substrate; 3) positioning a transfer-substrate on the conductive pattern layer and then performing thermal and pressure lamination so that the conductive pattern layer formed on the release-substrate is inserted or buried in the surface of the transfer-substrate; and 4) separating the release-substrate and the conductive pattern layer from each other, and to a buried flexible electrode film manufactured thereby.