SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS

SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS

A packaged semiconductor device has a lead frame, a semiconductor die, and bond wires. The lead frame has a two-dimensional array of leads with a subset of interior leads located in the interior of the array that do not extend to the perimeter of the array. The bond wires are connected to the semico...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HIEW PEY FANG, TEH SEOH HIAN, YAP JIA LIN, KHOO LY HOON, AU YIN KHENG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A packaged semiconductor device has a lead frame, a semiconductor die, and bond wires. The lead frame has a two-dimensional array of leads with a subset of interior leads located in the interior of the array that do not extend to the perimeter of the array. The bond wires are connected to the semiconductor die and respective ones of the leads of the array.