SEMICONDUCTOR DEVICE

According to one embodiment, a semiconductor device includes a semiconductor chip including a first terminal surface and a second terminal surface located on a side opposite to the first terminal surface. An insulation unit surrounds an outer circumference of a side surface of the semiconductor chip...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	MIYAKE EITARO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	According to one embodiment, a semiconductor device includes a semiconductor chip including a first terminal surface and a second terminal surface located on a side opposite to the first terminal surface. An insulation unit surrounds an outer circumference of a side surface of the semiconductor chip. A metal unit is disposed between the side surface of the semiconductor chip and an inner side surface of the insulation unit.